Remanufacturing Process for Surface Mount Assembly Systems:

1. All covers removed and professionally painted to standard Universal colors or special customer requests.

2. Machine completely cleaned to like new appearance.

3. Evacuate positioning system lubrication and relubricate entire positioning system - install grease inspection plates and replace bearings as necessary.

4. Perform positioning system parallelism process using special tools and fixture

5. Perform all engineering design updates/enhancements required including:
   * Memory upgrade to 32MB of RAM
   *  486 or higher Processor
   * Hard drive upgrade to 4.3 gigabyte or higher
   * Vision system upgrade to to Lantern 630  Vision System
   * Upgrade VME machine controller to include new 30 LITE CPU Board and provide updated Eproms on Themis P.C. board
   * Upgraded with CD ROM
   * Registered Software provided to most current level available
   NOTE: Universal software is licensed to original owner and is not transferable.

6. Machine reconfigured to customer specification. I.e.: Placement Head(s), camera(s), as well as many other features.

7. Placement head(s) completely rebuilt and upgraded to latest level

8. Nozzle changers rebuilt and tested on special test bed

9. Perform placement head(s) set-up including; Theta, Nozzle height, Vacuum, and Air kiss using specified fixtures

10. Perform diagnostic routine to completely check all electrical's of machines including P.C. boards, machine wiring, and communications.
    NOTE: Universal proprietary software is required for this diagnostic procedure

11. Perform complete motion control check of all machine axis
    NOTE: Universal proprietary software is required for this procedure

12. Perform complete placement/vision system calibration (requires a precision calibration fixture)

13. Perform complete Quality Assurance Procedure including:
    * Machine in customer final configuration
    * Four hour dry cycle of machine
    * Precision glass slug placements - glass slug placement accuracy checked on Voyager 1000 Coordinate Measuring Machine to accurately measure CPK value
    * Final Quality Assurance routine including placement of a full range of component types

14. All peripheral items i.e.: Component Shuttle,  PTF, Conveyors, etc. integrated with machine and tested as completed system.

Placement Systems:

Model 4681 GSM1™ (General Surface Mount Application Machine)
[ View Photograph | Configure Your Own | Brochure (pdf) | Available RGSMs ]
Universal’s GSM1 places a wide range of surface mount components from 0402 chips to 304-pin quad flat packs, using on-the-fly vision centering and squaring. This unit features a four-spindle placement head mounted on an overhead gantry positioning system, and can place up to 4,700 components per hour. The GSM1 is part of Universal’s platform-based family of products.

Model 4688 GSM2™ (General Surface Mount Application Machine)
[ View Photograph | Configure Your Own | Brochure (pdf) | Available RGSMs ]
Also based on Universal’s platform is the GSM2. Like the GSM1, the GSM2 places a wide range of surface mount components from 0402 chips to 304-pin quad flat packs, using on-the-fly vision centering and squaring. However, the GSM2 is 40% to 80% faster than the GSM1 on your component mix.

Adhesive Dispenser:

Model 4716 GDM Dispenser Module
[ View Photograph | Configure Your Own | Brochure (pdf) | Available RGDMs ]
Universal’s Model 4716 General Dispensing Module provides a precisely controlled method of applying adhesive dots to printed circuit boards to prepare them for placement of surface mounted components. This machine can place up to 43,000 dots per hour.

High Speed Chip Shooters:

Universal offers a variety of machines for high speed chip placement. All are ideal for high volume, topside and bottom-side surface mount applications.  Contact us pricing and availability of an RHSP.